TSMC budgets $9 billion for capital expenditures in 2013
is expected to be met, noted Chang who added that the company expects full utilization of its 28nm capacity in 2013. TSMC is also working on 20nm SoC, 10nm FinFET and 3D IC, promising more power, less space, and energy saving technology.
For the semiconductor industry as a whole, the executive sees a 2% drop in global revenue for 2012 with a 3% rebound higher next year. TSMC has outperformed the global industry and it is believed that this is due to the Grand Alliance. This is an open platform that keeps TSMC in close contact with its material and equipment suppliers and the company's customers for R&D of "innovative technologies".