TSMC kicks off 16nm FinFET manufacturing in 2013, to test EUV at 10nm in 2015
TSMC is the world’s largest semiconductor foundry, but is facing competition from Globalfoundries and Samsung. Led by 50-year silicon veteran Morris Chang, TSMC still expects growth in the teens this year while other fabless companies forecast 9% growth in 2013.
“It looks like we have another 7 to 8 years ahead in advances -- maybe more -- we can see in technology down to 10 and even 7nm,” said the TSMC CEO Chang.
“Moore’s Law is going to go on and we will be there -- if anyone pursues it, we will pursue it,” he told an audience of several hundred chip designers.
source: EE Times
4. Captain_Doug (Posts: 730; Member since: 10 Feb 2012)
Lowest possible is around 5-7nm. After that they'll have to make a new way to produce these chips or find out how to make them smaller.
6. TheLolGuy (Posts: 463; Member since: 05 Mar 2013)
At that point, chips will need a radical redesign from the ground up, or new materials for the transistors. Some candidates for this is carbon nanotubes, germanane, molybdenum sulfide, etc.
While the gaps may not close much more than that with these materials, they switch easier, conduct electricity much more effectively and thus can have much higher clock speeds as a result... theoretically :)
3. Captain_Doug (Posts: 730; Member since: 10 Feb 2012)
Wasn't there a stink about it not really being 10nm? It's actually 1X or something so it could be 10nm but it's most likely 19nm.
5. mittalmailbox (Posts: 36; Member since: 14 Feb 2012)
Graphene is the future, Graphene may help making several times faster chips with low power consumption.
7. wumberpeb (Posts: 392; Member since: 14 Mar 2011)
Graphene has a few years until they make it commercially viable and easily manufactured. The logical next step, already in progress, is 3D stacking. Chips on top of chips, building up without building out