Real-life photos of Huawei Mate S show a hump on its back that we hadn't seen before

With IFA 2015 drawing closer and closer, we keep getting various leaks about what Huawei intends to introduce at the superconference. It is next to certain that the company will unveil at least one smartphone, quite possibly a phablet-class one, but a second handset could be announced, too.

So far, we've heard names such as a Huawei Mate 7S, Huawei Mate S, and Honor 7 / 7 Plus be thrown around. We've also seen what the (most commonly reffered to as) Huawei Mate S would look like. Well, this latest leak shows us alleged real-life pictures of the upcoming phablet.

Something that we haven't seen before can be seen on the pictured phone's back – a hump of a module, which houses what looks like a fingerprint sensor and the camera. Could the extra girth of the module mean that the snapper's sensor will be OIS assisted? Probably, though rumors so far haven't mentioned anything further than the supposed sensor – a 13 MP Sony IMX 278.

As you can see, it's a relatively large handset – leaks suggest a 5.7-inch screen with a resolution of 1080 x 1920, a Kirin 935 chipset, and 3GB of RAM, along with 32GB of native storage. Nothing is concrete, but, with the unveiling event being closer and closer, expect further leaks in the following couple of weeks.