First alleged details around the upcoming Huawei Ascend P8 include a metal/ceramic body
1. vincelongman (Posts: 3986; Member since: 10 Feb 2013)
Ceramic buttons are cool, but a big ceramic back will easily back will easily shatter when dropped
Probably even easier to shatter than a glass black
2. Guaire (Posts: 495; Member since: 15 Oct 2014)
I'm pretty much sure it isn't P8. That body seems to me plastic and thick. Also it's camera on the middle despite rest of the Huawei P series.
Huawei's allegedly 2015 roadmap leaked a couple of days ago. According to that leak P8 will be ready in CES 2015. It has 5" FHD display, 32GB internal memory, 3GB RAM, Kirin 930 SoC and price will be 2999 yuan.
Almost half a year ago first rumors about Kirin 930 indicate it will be a 64-bit octacore and will be manufactured 16nm HiFET (not FinFET) process. I don't know whether or not that HiFET process is BS, but rumors claimed HiFET is different from FinFET and developed by TSMC and Huawei jointly. Suppose we will see soon.
Ceramic back isn't a new thing, they already utilized it back on P7 Sapphire Edition. They didn't revealed what kind of ceramic, but it was highly scratch resistant.
I would say don't underestimate ceramic materials. For example ALON is a optical ceramic rival to Sapphire. Famously implemented on transparent armors. Check out on some Youtube videos.
According to spec sheets it's more than twice as hard than Gorilla Glass, mean more scratch resistant, also it's fracture toughness thrice as superior, means less brittle. And they promise much better yield rates because of different manufacturing process so cheaper than Sapphire.
3. Taters (banned) (Posts: 6474; Member since: 28 Jan 2013)
I would have gotten the P7 if it had the SD801 or better. Unfortunately it had a garbage Kirin and not the nicer octacore.