Three-year old Huawei patent might allow production of 2nm chips using older DUV lithography

Unable to obtain an EUV lithography machine, Huawei looks to pull off a 2nm miracle using DUV.

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Huawei wordmark seen as lighted sign on a building.
As many of you know, the U.S. sanctions against Huawei prevent the manufacturer from obtaining cutting-edge chips if they were produced by a foundry using equipment containing parts made in America. Additionally, export controls put in place by the U.S. and the Dutch prevent any Chinese firm from obtaining the Extreme Ultraviolet (EUV) lithography machines needed to transfer complex circuitry patterns to the silicon wafers that are the foundations of SoCs.

SMIC used multi-patterning to build the processor used to power the Huawei Mate 80 Pro


Only one company makes the EUV machines needed to build chips using process nodes of 7nm and lower, and that is Dutch firm ASML. The latter is still able to sell Deep Ultraviolet (DUV) lithography machines to Chinese firms, but these are not as capable as EUV machines are when it comes to building advanced chips. However, using a technique called multi-patterning, China's largest foundry, SMIC, uses a DUV machine to print and etch the circuitry features as many as four times. A more capable EUV machine would require just a lone pass-through.


The problem with multi-patterning is keeping the patterns properly aligned. Typically yields are lower raising the cost of producing the chips. SMIC is rumored to have used multi-patterning to build the Kirin 9030 application processor (AP) with its N+3 process node. This AP, supposedly delivering 5nm-class performance, powers the newly released Huawei Mate 80 Pro Max.

The goal is to get 2nm-class performance without an EUV


Things could even get better for Huawei as a patent it filed in 2022 will supposedly allow it to perform advanced patterning equal to 2nm without the use of an EUV machine. A report from the English language South China Morning Post says that Huawei is looking to patent a method for manufacturing chips that uses a metal integration method. This would allow the use of DUV machines to integrate metal structures allowing chips to be built offering 2nm-class performance even without the use of an EUV.

Will Huawei ever achieve 2nm performance using a DUV?


A veteran of China's chip industry tosses out some speculation by saying that using the aforementioned metal integration, advanced memory, and unique architecture, a 14nm logic chip made using the technique described in the patent could equal the performance of Nvidia's 4nm GPUs made for AI. Huawei's 2022 patent is still pending and was announced this past January by China’s national intellectual property regulator. Interestingly, the report says that there is no evidence that the patent has been used yet to manufacture chips.

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