First alleged details around the upcoming Huawei Ascend P8 include a metal/ceramic body


It's been half a year since Huawei introduced the Ascend P7 to the market, and according to a new report out of China, a successor might be unveiled as early as next year's CES in the beginning of January.

According to MyDrivers, the Ascend P8 is already being tested internally. Their (unverifiable) intel points towards a 5.2-inch display with a standard resolution of 1080 x 1920 pixels, or a ppi of 424. Allegedly, the panel we'll be looking at is of the 2.5D type – those are tapered off at the edges like on the iPhone 6 – and will be supplied by an unknown Taiwanese manufacturer.

What's more interesting, however, is the claim that Huawei is apparently on track to make good on its promise to invest into smartphones with a more noble make, including metal and ceramics. Apparently, those are the exact materials the company has in mind for the P8, as we're told to expect a metal body with a ceramic back. Furthermore, MyDrivers' sources suggest that a 16 nm FinFET octa-core Kirin 930 might also end up powering the P8, though we're honestly quite skeptic. After all, TSMC is expected to start shipping as advanced silicon no earlier than late 2015, and that's if all goes as planned.

In any case, Huawei's use of as premium materials with the P8's body allegedly won't cause a spike in the pricing – the successor is said to cost 2,999 CNY (~$489).

Correction: This article previously (wrongly) stated that the image in the header might be that of the upcoming Ascend P8 while, in fact, it's of the 2012 Ascend D1 XL.

source: MyDrivers

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