First alleged details around the upcoming Huawei Ascend P8 include a metal/ceramic body

It's been half a year since Huawei introduced the Ascend P7 to the market, and according to a new report out of China, a successor might be unveiled as early as next year's CES in the beginning of January.

According to MyDrivers, the Ascend P8 is already being tested internally. Their (unverifiable) intel points towards a 5.2-inch display with a standard resolution of 1080 x 1920 pixels, or a ppi of 424. Allegedly, the panel we'll be looking at is of the 2.5D type – those are tapered off at the edges like on the iPhone 6 – and will be supplied by an unknown Taiwanese manufacturer.

What's more interesting, however, is the claim that Huawei is apparently on track to make good on its promise to invest into smartphones with a more noble make, including metal and ceramics. Apparently, those are the exact materials the company has in mind for the P8, as we're told to expect a metal body with a ceramic back. Furthermore, MyDrivers' sources suggest that a 16 nm FinFET octa-core Kirin 930 might also end up powering the P8, though we're honestly quite skeptic. After all, TSMC is expected to start shipping as advanced silicon no earlier than late 2015, and that's if all goes as planned.

In any case, Huawei's use of as premium materials with the P8's body allegedly won't cause a spike in the pricing – the successor is said to cost 2,999 CNY (~$489).

Correction: This article previously (wrongly) stated that the image in the header might be that of the upcoming Ascend P8 while, in fact, it's of the 2012 Ascend D1 XL.

source: MyDrivers

Related phones

Ascend P7
  • Display 5.0" 1080 x 1920 pixels
  • Camera 13 MP / 8 MP front
  • Processor HiSilicon Kirin, Quad-core, 1800 MHz
  • Storage 16 GB + microSDHC
  • Battery 2500 mAh(14h 3G talk time)



1. vincelongman

Posts: 5745; Member since: Feb 10, 2013

Ceramic buttons are cool, but a big ceramic back will easily back will easily shatter when dropped Probably even easier to shatter than a glass black

2. Guaire

Posts: 892; Member since: Oct 15, 2014

I'm pretty much sure it isn't P8. That body seems to me plastic and thick. Also it's camera on the middle despite rest of the Huawei P series. Huawei's allegedly 2015 roadmap leaked a couple of days ago. According to that leak P8 will be ready in CES 2015. It has 5" FHD display, 32GB internal memory, 3GB RAM, Kirin 930 SoC and price will be 2999 yuan. Almost half a year ago first rumors about Kirin 930 indicate it will be a 64-bit octacore and will be manufactured 16nm HiFET (not FinFET) process. I don't know whether or not that HiFET process is BS, but rumors claimed HiFET is different from FinFET and developed by TSMC and Huawei jointly. Suppose we will see soon. Ceramic back isn't a new thing, they already utilized it back on P7 Sapphire Edition. They didn't revealed what kind of ceramic, but it was highly scratch resistant. I would say don't underestimate ceramic materials. For example ALON is a optical ceramic rival to Sapphire. Famously implemented on transparent armors. Check out on some Youtube videos. According to spec sheets it's more than twice as hard than Gorilla Glass, mean more scratch resistant, also it's fracture toughness thrice as superior, means less brittle. And they promise much better yield rates because of different manufacturing process so cheaper than Sapphire.

3. Taters

Posts: 6474; Member since: Jan 28, 2013

I would have gotten the P7 if it had the SD801 or better. Unfortunately it had a garbage Kirin and not the nicer octacore.

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