LeEco Le Max 3 leaks with dual camera, chunky metal body prior to April 11 announcement
Notably, the smartphone features a dual camera and what looks like two LED flashes below the lens. Other points of interest include an USB Type C port, a chamfered metal frame, and a fingerprint scanner on the back.
Based on previous leaks, the Le Max 3 is powered by the Snapdragon 821 SoC, which is found in most high-end phones from last year and some early 2017 models.
It's also said to have a 5.7-inch display with 1440 x 2560 resolution, along with 4GB of RAM and 64GB of storage. The dual camera is spec'd with 13MP sensors, while the front cam has a 16MP sensor. The software seen running is Android 6.0.1, skinned with LeEco's EUI 5.8.
Also known as the Le X850, the Le Max 3 will be announced April 11. LeEco will probably sell this one in the USA as well, seeing that it uses a Qualcomm chip.
source: SlashLeaks via Android Headlines