Ahead of tomorrow's Snapdragon 820 unveiling, Qualcomm says overheating will not be an issue
With less than a day to go until the grand unveiling, the company's head of marketing recently took to Twitter to announce that the Qualcomm Snapdragon 820 beats the thermal requirements of device makers. Despite numerous reports which pointed out that the current-generation Snapdragon 810 chipset features poor thermal performance, Qualcomm has often denied such reports in the past six months. Hopefully, these new claims regarding the thermal efficiency of the Snapdragon 820 will turn out to hold water when the first devices powered by the beast reach our testing lab.
According to our current expectations, which are based on both rumors and official information from Qualcomm itself, the Snapdragon 820 should come with a new dual-cluster quad-core processor with custom CPU cores, a new and significantly Adreno 530 GPU, support for dual-channel LPDDR 4 RAM, Cat. 10 LTE connectivity, as well a dedicated low-power sensor hub for always-on use cases. Qualcomm has recently confirmed that the Snapdragon 820 will be built using the 14nm FinFET non-planar node technology, which is thought to mean that the chip will be manufactured by Samsung.
Although each product launch has its own importance, it's safe to say that Qualcomm has a lot riding on the success of the Snapdragon 820. The chip maker lost a tempo with the Snapdragon 810, a chip that packed a lot of processing power but was plagued by overheating issues, and it definitely cannot afford to skip another beat if it wants to maintain its position as the world's leading mobile chipset manufacturer.
What do you guys think? Are you ready for the beast?
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