The MT6797 will reportedly offer a 40% boost in performance when compared to the prior Helio X10 chips put out by MediaTek. That includes the MT6795 which is found inside the recently unveiled HTC One M9 Plus.
The MT6797 will employ MediaTek's Tri-Cluster CPU Architecture. The 4+4 A53 cores will use the big.LITTLE architecture to provide a balance of power and efficient battery use. The chip will be produced using TSMC's 20nm process and does support LTE-A/Cat. 6. The latter provides data speed as fast as 300Mbps.
Mass production of the MT6797 is expected to begin in July, which means it could be the end of the year before manufacturers start using the chip inside new smartphones. The big question is whether MediaTek can break into the U.S. market and provide a real challenge to Qualcomm.
source: Weibo via GizmoChina