LeTV Max 2 to feature Snapdragon 820 chipset inside?
According to a report published today out of China, the LeTV Max 2 will feature different hardware with a more beautiful appearance. This way, LeTV can accommodate both those who want their handset to look good, and those who want their phone to come with the highest specs. For looks, the LeTV Max 2 is expected to have glass in front, and in back. For power users worried about battery use, if the Snapdragon 820 chipset is powering the device, the phone will offer Quick Charge 3.0. This allows the handset's battery to charge to 80% of capacity in just 35 minutes. That might change if LeTV needs to stuff a larger capacity cell inside the unit.
The leaked image of the back of the phone shows a cut out in the middle of the back for the rear-placed fingerprint scanner; the holes cut out in the top corner are probably for (going in order of the size of the hole) the camera, flash and microphone.
The Snapdragon 820 SoC is equipped with a quad-core CPU using Qualocomm's proprietary Kryo cores, along with the Adreno 530 GPU. We don't expect to see the LeTV Max 2 released until the first quarter of 2016 is close to coming to an end.
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source: mobile-dad (translated) via XiaomiToday