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Ericsson and Texas Instruments sign joint agreement on GPRS and 3G handset solutions

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As an extension of a memorandum of understanding signed September 2001, Ericsson Mobile Platforms and Texas Instruments havesigned an agreement for GPRS and 3G reference design platforms basedon TI's advanced silicon technology.

Ericsson will offer third generation mobile phone reference designplatforms including TI semiconductor solutions enabling wirelessequipment manufacturers to bring their products to market faster andwith reduced R&D investment.

Ericsson Mobile Platforms' open solutions will include digital signalprocessors for baseband, RF components as well as applicationprocessors. Under the agreement, Texas Instruments will supply thecore components for Ericsson's reference design solutions. Thesesolutions will support a full range of handsets, addressing allmarket segments, including bandwidth-intensive and multimedia-richwireless applications enabling services such as multimedia messaging,video and Internet audio downloads, e-mail, real-time Web browsing,advanced security, games and location-based services.

"We are pleased to support Ericsson Mobile Platforms' solutions as a strategic TI-powered UMTS offering to the 3G market," said Gilles Delfassy, TI Senior Vice President and General Manager for TI's Wireless Terminals Business Unit. Working with Ericsson Mobile Platforms on the new reference designs extends our commitment to help wireless equipment manufacturers bring products to market quickly and easily."

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