x PhoneArena is hiring! Reviewer in the USA

Sony allegedly battling with Snapdragon 810 heat dissipation from the thin Xperia Z4

Posted: , posted by Daniel P.

Tags :

Sony allegedly battling with Snapdragon 810 heat dissipation from the thin Xperia Z4
While Sony might not announce its Xperia Z4 flagship before Q2 draws to a close, we already know some specs from leaked benchmarks, and the overall chassis appearance from a few frames that popped up recently. The Geekbench database, for instance, lists a mysterious Sony device that runs Android 5.0.2 Lollipop, and is powered by an octa-core Qualcomm MSM8994 processor - which is none other than the Snapdragon 810.

Qualcomm already mentioned Sony in a puff piece about the Snapdragon 810 chipset's virtues, so there is every chance that this is what the Xperia Z4 will be using. Famed leakster Ricciolo, however, is tipping that Sony might be looking for engineering solutions to dissipate the arguably significant amount of heat that Snapdragon 810 generates, without compromising the chassis structure of what might be one of the thinnest flagships around when it lands. 

Well, Sony is the company that just gave us the world's thinnest slate - the Xperia Z4 Tablet - and this one is powered by an 810 processor, but, of course, there's much more surface for heat dissipation on a 10" slate than on a compact smartphone. Still, we have a firm belief in Sony's engineering prowess, and can't wait for the final Xperia Z4 design to emerge.

Sony allegedly battling with Snapdragon 810 heat dissipation from the thin Xperia Z4
source: Ricciolo (Twitter)

66 Comments
  • Options
    Close





Want to comment? Please login or register.

Latest stories