HTC and others are testing NMT metal/plastic bonding for thinner but tougher smartphone chassis

HTC is reportedly testing the NMT technology for a future smartphone, with the help of Chenming Mold Industrial, with "several first-tier handset vendors" also expressing interest in the plastic/metal fusion process.

The ability to directly inject the plastic to the etched metal chassis, and dispose with the current unwieldy system of small slots, layers and latches which makes the battery cover of the HTC Sensation 4G, for instance, will allow weight, bulk and complexity to be reduced from all smartphone designs where metal meets plastic. This way the united chassis will also be tougher and more durable.

It's interesting what future handset is HTC working on that will feature this technology in its shell and other components, but we probably won't know until it's time for the holiday phone crop leaks. CMT's chairman, however, said that the NMT process will be ramped up to mass production as soon as July.

source: DigiTimes via SlashGear