Chipworks tears down Apple iPhone 6: Apple A8 and iSight camera secrets revealed
The teardown gives us pictures of the iPhone 6 mainboard (that most of you have already seen in leaks and in the earlier, iFixit teardown), but quickly jumps in to more detailed ‘x-ray’ images of the more notable single chips.
Apple A8 die pictures: 20nm, TSMC-made
Some interesting details appear when you look at the packaging: the A8 switches to a different nomenclature, from the ‘98’ suffix for the APU (the Apple A5 was the APL0498, for instance) to an ‘11’ suffix here (the Apple A8 is marked as APL1011).
A cross section of the A8 shows that the chip is made of 10 metals in the stack. Interestingly, the die picture suggests that Apple has made some re-arrangements to the chip with what seems like the Cyclone dual-core processor now in the bottom right corner, while the GPU cluster seems to occupy the bottom left part (that’s just our guess, though).
iSight camera: a larger module, 'Focus Pixels' galore
The main iSight camera is again manufactured by Sony, and it’s a stacked, Exmor RS sensor with backside illumination. The exact size of the camera module is 10.6 mm x 9.3 mm x 5.6 mm thick (vs 8.6 mm x 7.8 mm x 5.6 mm thick on the iPhone 5s), and die size stands at 4.8 mm x 6.1 mm (29.3 mm2).
You can find images of many other iPhone 6 components in the slideshow below, all courtesy of Chipworks.