Sony Xperia Z5 Premium leaked teardown photo reveals dual heat pipes and thermal paste

Most of you guys have probably been introduced by now to the Sony Xperia Z5 Premium, the world's first smartphone with a 4K display. Although our quick hands-on time with the Sony Xperia Z5 Premium was enough to verify that the smartphone really comes with a breathtaking display, there are still many reasons why we think that the industry doesn't need a 4K smartphone just yet. One of these reasons is that current-generation chipsets already have a tough time dealing with QHD displays and that the extra stress on the chipset will lead to increased temperatures and sluggish performance due to thermal throttling.

Since the Sony Xperia Z5 Premium comes with a Qualcomm Snapdragon 810 chipset, a mobile SoC that's been very often criticized for its thermal performance, many are probably wondering if Sony was able to keep the overheating issues in check without limiting the performance of the chipset too much. While that's still to be discovered when the final units get to our testing lab, a new photo leaked online today allegedly revealing the measures that Sony had to come up with in order to keep the Snapdragon 810 overheating issues under as much control as possible. Take a look: