Huawei's Yu says super slim P series model to be displayed at MWC; 8-core chip coming

Huawei's Yu says super slim P series model to be displayed at MWC; 8-core chip coming
Huawei has brought a few interesting things to the table at CES 2013. The Huawei Ascend Mate made some friends with its 6.1 inch screen while the Huawei Ascend D2 added another 5 inch 1080p 441ppi pixel density phone to the Android rolls. And don't forget Huawei's first Windows Phone 8 model, the Huawei Ascend W1.

Huawei Consumer Business Group CEO Richard Yu passed along some additional information at the trade show. He said that the company will be producing octo-core Cortex A-15 chips in the second half of this year, matching Samsung. He hinted that the HiSilicon K3V3 chipset could end up in the sequel to both the Huawei Ascend Mate and the Huawei Ascend D2. He also chatted about a super slim P-series model that will be revealed at MWC 2013 in Barcelona next month. Yu says that the device will be thinner than the 6.45mm Alcatel One Touch Idol Ultra and will have a metallic body. Sounds like Huawei is in the "zone".

source: EngadgetChina (translated) via Engadget

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