The new Apple iPhone 7 and iPhone 7 Plus are here, and they bring double the storage, some significant improvements to the camera, water-proofing, and a brand new home button, but the big highlight of the pair is without a doubt the brain that powers the phone: the Apple A10 system chip.
While Android phones have been using big.LITTLE designs with larger, performance driven CPU cores for intense tasks and smaller, battery-savvy cores for less demanding tasks, the iPhone 7 series is the first time that Apple implements this in a mobile phone. Naturally, a ton of question emerges about this new chip. Chipworks' teardown, complete with the addition of X-rays of the innards of the phone, reveal a lot of the secrets behind the Apple A10.
Another interesting detail is that the A10 seems packaged to TSMC's new Integrated Fan Out (InFO) tech that saves precious space by eliminating the organic substrate that dies are traditionally mounted on. Everything is also very tightly, densely packed, and that allows Apple to keep a reasonable size for this chip.
Secondly, there is a new Intel modem in the iPhone, and that's interesting because most phones and earlier iPhones have long relied on Qualcomm models. Not the iPhone 7 family, though, as it has the Intel XMM7360 modem. The modem die size measures 66.4 square mm.
You can take a look at the full X-ray of the A10 chip right below, or skip over to the source link for the full teardown.