Front panel of Xiaomi 8th anniversary phone appears alongside retail packaging

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Front panel of Xiaomi 8th anniversary phone appears alongside retail packaging
Both the front panel and retail packaging of Xiaomi’s rumored 8th-anniversary smartphone have leaked out. It’s no secret that Xiaomi is holding an event next week where it is expected to announce its next flagship, the Mi 7, and the third-generation of its popular Mi Band. However, due to the company’s 8th anniversary, the brand is reportedly preparing a third product in celebration of the milestone, something two recent leaks appear to confirm.

Beginning with the retail packaging of the smartphone, the details it reveals are relatively few, with the box simply sporting a large number 8 on top of the gray-colored packaging, while the Xiaomi logo is also featured in the top-right corner. However, when it comes to the front panel, a number of clues as to what can be expected from the smartphone are provided. Starting with the overall shape of the panel, it’s clear Xiaomi will be following in the footsteps of recent trends by introducing a tall display complete with a notch up top. Unfortunately, a rather large chin appears to be present below the display. Nevertheless, upon inspection of the notch, cutouts for a variety of sensors are clearly present, backing up with recent rumors. After all, it has been reported that Xiaomi is set to introduce its own 3D sensing technology that will rival Apple’s Face ID and is most likely the reason behind two of the sensor cutouts. When it comes to the remaining two cutouts, though, these are likely part of a dual-camera selfie setup.

In regards to the internal aspect of Xiaomi’s anniversary smartphone, Qualcomm’s Snapdragon 845 is believed to be inside along with 8GB of RAM and possibly 128GB of internal storage. Additionally, an in-display fingerprint scanner could make an appearance. Also, Android 8.1 Oreo is expected to come pre-installed straight out of the box.




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