New iPhone 6s schematics have popped up, allegedly leaking the layout of Apple's upcoming A9 system chip, and indicating that the new iPhone will have unusually high number of improvements under the hood, despite keeping the same look and feel as the current iPhone 6.
First off, the leaked chipset drawings indicate that Apple would indeed be employing a System in Package (SiP) technology along with a Printed Circuit Board (PCB) architecture. The SiP technology is used by Cupertino in the Apple Watch, and it allows for faster production of more compact and more efficient circuitry. If just a small part of the system turns out faulty, though, the whole package goes down the drain. In any case, the schematics also show that the CPU shielding cover has heat-dissipation fins that are just 1mm thin, and the processing package is about 15% smaller than the A8 system chip in the iPhone 6.
There is also no baseband radio printed on the motherboard, and it will likely be a separate module, as usual. The most interesting for the average consumer thing we are eventually learning from these drawings, however, is that the iPhone 6s will still come in 16 GB, 64 GB and 128 GB versions, so any basic storage upgrades might eventually be left for next year's edition.