Back in September, the Exynos 8890 rewrote the record books at Geekbench. The chip scored an all-time high of 6908 on the multi-core segment of the test. On the single-core test, the Exynos 8890 produced a 2294 score. The chip is produced by Samsung using the 14nm FinFET process. According to earlier reports, Samsung will be employing the Snapdragon 820 for U.S. and Chinese variants of the Galaxy S7. The rest of the world will get the version with the Exynos 8890 under the hood.
We could see the Galaxy S7 arrive with a flat-screened 5.2-inch model, and a unit sporting a 5.7-inch curved screen. Despite talk of an earlier than expected unveiling, the new flagship might be introduced to the public on February 21st. That will be the day before the MWC show begins in Barcelona. The Samsung Galaxy S5 and Samsung Galaxy S6 were both unveiled the day before the MWC show in 2014 and 2015, respectively. In addition, the Samsung Unpacked 2016 event will take place on February 21st. Historically, the latest Galaxy flagship has been announced during one of these events.
source: Mobipicker, GSMArena