Apple to use SiP technology for the next iPhone?
According to a rumor that originated in China, Apple will use a simplified PCB and a SiP design for the next iteration of the Apple iPhone. Already dubbed the Apple iPhone 6s and Apple iPhone 6s Plus, the two models will have half of their internal components wrapped up in one SiP module, if this rumor is legit. Additionally, the technology dovetails with the Integrated fan-out wafer-level packaging (InFO-WLP) rumored to be found on the Apple A9 SoC. This is a process introduced by TSMC last year. While some reports have the A9 being produced with InFO-WLP, other reports say that this won't take place until the Apple A10 is produced in 2016.
Apple is said to be so smitten with the SiP technology that it is rumored to completely eliminate the PCB for the Apple iPhone 7. That would leave extra room inside the iPhone to add a larger capacity battery.
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