Apple to use SiP technology for the next iPhone?

Apple to use SiP technology for the next iPhone?
Hindered by the smaller size of the Apple Watch, the company used a System in Package design (SiP) to replace the Printed Circuit Board used in devices like the Apple iPhone. The application processor, support processors, sensors, storage and memory for the Apple Watch are rolled together in the one SiP module that takes up less space than a PCB.

According to a rumor that originated in China, Apple will use a simplified PCB and a SiP design for the next iteration of the Apple iPhone. Already dubbed the Apple iPhone 6s and Apple iPhone 6s Plus, the two models will have half of their internal components wrapped up in one SiP module, if this rumor is legit. Additionally, the technology dovetails with the Integrated fan-out wafer-level packaging (InFO-WLP) rumored to be found on the Apple A9 SoC. This is a process introduced by TSMC last year. While some reports have the A9 being produced with InFO-WLP, other reports say that this won't take place until the Apple A10 is produced in 2016.

Apple is said to be so smitten with the SiP technology that it is rumored to completely eliminate the PCB for the Apple iPhone 7. That would leave extra room inside the iPhone to add a larger capacity battery.

Thanks for the tip!

source: GforGames

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8 Comments

1. waddup121 unregistered

truly innovative.

2. AppleCultist

Posts: 335; Member since: Feb 18, 2015

lol? This is all technology made by other companies.

19. jove39

Posts: 2140; Member since: Oct 18, 2011

Yeah and samsung is one of them :) I appreciate apple taking this step. There are many benefits at the cost of yield rate...which will improve eventually...really fast ram and storage as result of direct access...high clock for cpu & gpu as a result of saved power budget. I am looking forward to new iPhone.

3. arch_angel

Posts: 1651; Member since: Feb 20, 2015

well amusing is already combining there internal parts together to make room inside for more stuff apple is late to the game.

6. SamsungEU

Posts: 147; Member since: Dec 29, 2014

i doubt they will increase the battery capacity, they will focus on making it slim

10. Iodine

Posts: 1471; Member since: Jun 19, 2014

It will be an iPhone 6S which means more or less the same design with no reduction in thickness.

7. dimas

Posts: 3296; Member since: Jul 22, 2014

So for android phones, this is called SoC and they've been doing this for years yes?

11. Iodine

Posts: 1471; Member since: Jun 19, 2014

So giving it a ultra efficient 16nm TSMC FF+ process, some new packaging techniques and integration of half of internals into a single package to leave room for a seriously bigger battery.... The battery life is going to be absolutelly awesome, especially on the iPhone 6S Plus.

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