Samsung's new Exynos ModAP chip to compete with Qualcomm's Snapdragon silicon
Samsung introduced its new Exynos ModAP chip on Thursday. This combines an application processor, and a modem, into one SoC. The chip is produced using the 28nm process, and includes a dedicated image signal processor to provide high-quality image and video capture and playback. The ModAP chip accomplishes this while using less energy than previous chips, and will compete with Qualcomm's higher priced Snapdragon systems. The latter also combine an applications processor with a modem.
In addition to the Exynos ModAP, Samsung also introduced a 300 series modem that supports older 2G and 3G networks such as HSPA+, TD-SCDMA and GSM. The chip also supports newer networks such as LTE, and LTE-A with carrier aggregation. Samsung also introduced on Thursday, a new Exynos RF IC baseband transceiver. The new chip works with multi-band and multi-mode LTE pipelines.
There is no word yet from the manufacturer as to when these new chips will be available.
There is no word yet from the manufacturer as to when these new chips will be available.
source: Samsung via Phonescoop
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