World's thinnest LTE chip might make your next AT&T 4G LTE tablet Phat
The thinnest LTE chip, the AirPrime EM7700
Sierra Wireless has introduced the world's first thin form factor embedded wireless module for 4G LTE networks. The Sierra Wireless AirPrime™ EM7700 is a nominal 2.5 millimetres thick and is ideal for tablets and ultra-portable notebooks where thinness is a critical design constraint. The EM7700 is designed to support Windows 8, utilizes Qualcomm's Gobi™ 4G LTE modem and is compatible with Qualcomm's API and the USB-IF mobile Broadband Interface Model (MBIM) for easy integration by PC OEMs.
It offers a connectorized interface to enable build-to-order logistics, allowing manufacturers to offer it as an optional add-on to their devices. The AirPrime EM7700 also supports HSPA+ and 3G technologies for use in areas where LTE is not yet available.
Made exclusively for connecting to the AT&T 4G LTE network, the AirPrime EM7700 is based on the AirPrime MC7700 module, which was certified by AT&T last year
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