Report: Low yields force TSMC to revert to 8 inch wafers for Apple iPhone 6 fingerprint sensors
0. phoneArena 11 Feb 2014, 00:20 posted on
According to a published report on Tuesday citing industry sources, Apple wanted TSMC to produce fingerprint sensors for its next-gen Apple iPhone using the silicon slinger's 12 inch facilities and 65nm process. But the low yields associated with this technology has forced a change. Apple has decided to go with TSMC's 8 inch processing in order to get the kind of yields it needs to produce a large number of handsets...
This is a discussion for a news. To read the whole news, click here
1. markhsu (Posts: 15; Member since: 17 Mar 2012)
TSM having yield issues? The hell you say. If they are already having yield issues with the fingerprint sensor imagine what will happen with the A8. I hear a call to their old pal Sammie coming.
2. Finalflash (Posts: 899; Member since: 23 Jul 2013)
Classic TSMC, a lot of people called it out when the switch to TSMC was announced. This is just them dropping the ball again as they did almost every time with Nvidia and ATI. This is on the 65 nm node too, how the hell are they going to produce anything on their 20 nm node with something like an A8?
3. roscuthiii (Posts: 1659; Member since: 18 Jul 2010)
They Sorta Misconstrue Competency?