Report: Low yields force TSMC to revert to 8 inch wafers for Apple iPhone 6 fingerprint sensors
Had TSMC and Apple gone with the 12 inch WLPs, TSMC would have produced the entire chip, including the back-end testing and packaging, in-house. With the move back to 8 inches, TSMC will work on the front-end while back end packaging will be subcontracted to firms like Xintec and China WLCSP.
Yield rates for 8 inch wafers exceed 95% while they drop down to between 70% to 80% for the 12 inch wafers at TSMC's Southern Taiwan Science Park. While the Apple iPhone 5s was in its early days of production, yields on the 8 inch wafers were low enough to hinder production. Eventually, TSMC should be able to pick up yield rates on the larger wafers which will save money for Apple.
1. markhsu (Posts: 15; Member since: 17 Mar 2012)
TSM having yield issues? The hell you say. If they are already having yield issues with the fingerprint sensor imagine what will happen with the A8. I hear a call to their old pal Sammie coming.
2. Finalflash (Posts: 1437; Member since: 23 Jul 2013)
Classic TSMC, a lot of people called it out when the switch to TSMC was announced. This is just them dropping the ball again as they did almost every time with Nvidia and ATI. This is on the 65 nm node too, how the hell are they going to produce anything on their 20 nm node with something like an A8?
3. roscuthiii (Posts: 1785; Member since: 18 Jul 2010)
They Sorta Misconstrue Competency?